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Jasper hu's List: Semi

China's Chip Industry Facing Challenges

www.semiconductor.net/index.asp - Preview

on 2008-11-09
EETimes.com - Qualcomm leaps into top 10 among chip suppliers

www.eetimes.com/...showArticle.jhtml - Preview

on 2008-11-08
- Broadcom also leapfrogged Nvidia Corp. to become the second largest fabless chip vendor, according to the data
Print Version - Chips reembrace multicore architecture

www.eetasia.com/ARTP_8800550496_499489.HTM - Preview

on 2008-11-03
- Homogenous vs. heterogeneous
Print Version - Frequency synthesizer offers sub-picosecond jitter

www.eetasia.com/ARTP_8800550666_590626.HTM - Preview

on 2008-11-03
- low-noise VCO
- -60dBc power-supply noise rejection.
EETimes.com - Freescale dragged to loss; will lay off 10%

www.eetimes.com/...showArticle.jhtml - Preview

on 2008-11-03
- Freescale (Austin, Texas) also said it would reduce its global workforce by about 2,400 jobs as part of a restructuring program that the company expects will save more than $400 million per year
Print Version - Express Logic, Renesas ready MP3 platform

www.eetasia.com/ARTP_8800549931_499495.HTM - Preview

on 2008-10-28
- royalty-free licenses
An ASIC methodology emerges in Taiwan - Practical Chip Design - Blog on EDN - 1690000169

www.edn.com/...1570035557.html - Preview

on 2008-10-27
- superset
RTL power analysis enhances process geometries

www.eetasia.com/0549599_480400_NP_aed8ec56.HTM - Preview

on 2008-10-24
- RTL power analysis enhances process geometries
EETimes.com - Pricing of TFT-LCDs continues to fall

www.eetimes.com/...showArticle.jhtml - Preview

on 2008-10-24
- DisplaySearch defines cash cost as including the yielded bill of materials (BOM) costs, labor costs and indirect expenses. The manufacturing cost is the sum of cash cost and depreciation. The total cost (break-even point) is the sum of manufacturing costs and sales, general and administration expense (SG&A).
EETimes.com - Pricing of TFT-LCDs continues to fall

www.eetimes.com/...sionid=U0CRX3XPO2OWKQSNDLSCKHA - Preview

on 2008-10-24
- DisplaySearch defines cash cost as including the yielded bill of materials (BOM) costs, labor costs and indirect expenses. The manufacturing cost is the sum of cash cost and depreciation. The total cost (break-even point) is the sum of manufacturing costs and sales, general and administration expense (SG&A).
EETimes.com - Video: Cypress Semi's T.J. Rodgers on economy, downturn

www.eetimes.com/...sionid=CJM4H2CKIPSVKQSNDLSCKHA - Preview

on 2008-10-22
- Cypress Semi's T.J. Rodgers on economy, downturn
Graphics processing unit - Wikipedia, the free encyclopedia

en.wikipedia.org/...index.php - Preview

on 2008-10-20
- Integrated graphics solutions, or shared graphics solutions are graphics processors that utilize a portion of a computer's system RAM rather than dedicated graphics memory
- GPU's SIMD architecture
Graphics processing unit - Wikipedia, the free encyclopedia

en.wikipedia.org/...Graphics_processing_unit - Preview

on 2008-10-20 and saved by 4 people
- Integrated graphics solutions, or shared graphics solutions are graphics processors that utilize a portion of a computer's system RAM rather than dedicated graphics memory
ChipEstimate.com - Chip Planning Portal

www.chipestimate.com/...techtalk_080212.html - Preview

on 2008-10-18
- hot carrier injection (HCI)
- The problem is that
  the USB specification requires a 3.3V rail on the transmit (TX) and
  receive (RX) lines. TX must signal a minimum VOH of 2.8V, and RX can
  see a maximum VIH of 3.63V. Other signals (DP/DM and VBUS) can see signals
  as large as 5.25V.
- 8 more annotations...
- - - 0.9 to 1.2V for
    digital and low-voltage analog circuits
    
    - 2.5V to supply
    the analog circuitry
    
    - 3.3V to supply
    the USB PHY I/O that handles higher voltage levels
  - nanoPHY
  - For example, a separate power-management
    chip is a good candidate for integrating the PHY
  - The "dis-integration"
    approach relies upon a relatively new USB standard called the UTMI+
    Low Pin Interface (ULPI) for connecting the USB controller and PHY
  - ULPI reduces the interface from approximately 40 - pins to 8 - 12 pins.
  - eliminating cables and the analog component
    in the PHY
  - Link Power Management
    (LPM)
  - he DesignWare USB 2.0 nanoPHY's floorplan allows the digital
    block to scale with smaller process geometrie
EETimes.com - Cypress' sun goes down as it posts loss

www.eetimes.com/...JM5K4TA1ITOQSNDLRSKHSCJUNN2JVN - Preview

on 2008-10-17
- discontinued operation
Single-chip DSP integrates three 1GHz cores

www.eetasia.com/0548443_499489_NP_6eef7718.HTM - Preview

on 2008-10-17
- signal chain solution
- software debug platform
- 1 more annotations...
- - Integrated Development Environment (IDE)
Power struggles: slashing power use in mobile audio

www.eetasia.com/0548298_499495_NT_acd54bb4.HTM - Preview

on 2008-10-17
- Reduce the size of the MOS device in the codec, and flicker noise increases; increase resistance and thermal noise also rises
- Even minimizing the supply voltage in the analog environment isn't necessarily the solution, as this has an effect of reducing signal swing, which has a negative effect on SNR
- 2 more annotations...
- - Figure 2 shows how having the same SNR from a lower supply voltage can increase power use
  - This is caused by the need to raise bias currents to lower thermal noise and compensate for the loss of signal swing
Intel heeds caution amid financial quandary

www.eetasia.com/0548419_499488_NT_f3c3a020.HTM - Preview

on 2008-10-17
- profit of $2 billion
- operating income
- 4 more annotations...
- - gross margin
  - Mobility product group
  - Net revenue
  - Digital Enterprise group
Spansion, ASE ink JV deal on China facility

www.eetasia.com/0548428_480200_NT_8c3748ef.HTM - Preview

on 2008-10-17
- final manufacturing service
EETimes.com - AMD beats expectations, but posts 8th straight loss

www.eetimes.com/...sionid=04SXFEMBSCWKOQSNDLSCKHA - Preview

on 2008-10-17
- net loss
- continuing operations
- 2 more annotations...
- - net income
  - operating income

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Jasper hu

26 items | 26 visits

Updated on 2008-11-09
Created on 2008-11-09

Category: Others

Semiconductor IC ASIC

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Jasper hu's List: Semi

China's Chip Industry Facing Challenges

EETimes.com - Qualcomm leaps into top 10 among chip suppliers

Print Version - Chips reembrace multicore architecture

Print Version - Frequency synthesizer offers sub-picosecond jitter

EETimes.com - Freescale dragged to loss; will lay off 10%

Print Version - Express Logic, Renesas ready MP3 platform

An ASIC methodology emerges in Taiwan - Practical Chip Design - Blog on EDN - 1690000169

RTL power analysis enhances process geometries

EETimes.com - Pricing of TFT-LCDs continues to fall

EETimes.com - Pricing of TFT-LCDs continues to fall

EETimes.com - Video: Cypress Semi's T.J. Rodgers on economy, downturn

Graphics processing unit - Wikipedia, the free encyclopedia

Graphics processing unit - Wikipedia, the free encyclopedia

ChipEstimate.com - Chip Planning Portal

EETimes.com - Cypress' sun goes down as it posts loss

Single-chip DSP integrates three 1GHz cores

Power struggles: slashing power use in mobile audio

Intel heeds caution amid financial quandary

Spansion, ASE ink JV deal on China facility

EETimes.com - AMD beats expectations, but posts 8th straight loss

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