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www.eetimes.jp/...35505_1_20080606223216.cfm - Cached
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カーボン・ナノチューブからなる半導体チップがいよいよ実用化の時期を迎えた。米Nantero社は、米SVTC Technologies社と組み、世界初の8インチのカーボン・ナノチューブ極薄フィルムを開発するファウンドリ事業を進めていく。
nano material engineering
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